Introducing the Hi-620D BGA Rework Station, a high-performance semi-automatic soldering workstation designed for professional repair of motherboard and chip-level components. Manufactured by the original factory, this unit ensures reliable quality and consistent performance.  

Top heater(1200w)
1. Air outlet design ensure focusheating,effective to increase success
rate;
2. Top air reflow is adjustable,suit
for any chips;
3.Nozzle equipped different size fordifferent chip

Down heater(1200w):
1. Focus heating on desoldering chip;
2.Height is adjustable;
3. Heat-detector:Can't move,it is used for test temperature
4. This screw can adjust to support PCB

Large IR heating Panel
1. Preheating PCB,make heatingmoreevenly;
2. Protect the PCB avoid deformationduring working;
3. Infrared heating is more easilyabsorbed by PCBincrease repair success

Monitor
1.1080p HD monitor
2.ln the picture,the blue point is forsoldering IC,yellow point is for PCB

HD Camera
1. Highprecision CCD alignment system;
2. 5 million pixel;
3.Mounting accuracy canreach +0.01mm

X Y axis
1. Adjust PCB left&right,Front&back;
2. Ensure every bga and pcb solderingpoint matching;
3.Increase repair success rate

Safety Protection System
The circuit can power off automatically when temperature abused,with doubleover temperature protection;
Temperature parameter having password protection to prevent any modification.

Product selling points
High quality: Made of high-quality materials, it is durable and has a long service life. The BGA welding station is very suitable for use in studios, factories, offices, and other occasions.
Optical positioning: Use CCD optical lens micrometer to adjust the accuracy to 0.01mm
Precision: The welding station has high efficiency, stable performance, and long service life.
Easy to operate: Easy to use, suitable for repairing various electronic products.

**Key Features:**  
- **Optical Alignment System** – Provides precise positioning for BGA components, ensuring accurate placement and rework.  
- **Automatic Desoldering** – Efficiently removes chips and components without manual intervention, reducing the risk of damage.  
- **Precise Temperature Control** – Advanced closed-loop temperature regulation delivers stable and accurate heating profiles for different solder pastes and components.  
- **Semi-Automatic Operation** – Balances manual flexibility with automated convenience, ideal for both批量 and single-unit rework.  

**Wide Application:**  
Suitable for repairing mainboards, graphics cards, and processors in:  
- Mobile phones (including Apple iPhone)  
- Computers and laptops  
- Television sets  
- Drones  
- Electric vehicles (EVs)  
- Game consoles (PlayStation, Xbox, Nintendo, etc.)  
- Other consumer electronics with BGA chips  

**Why Choose Hi-620D?**  
- Original factory direct supply – no middlemen, best value.  
- Robust build quality for daily professional use.  
- Perfect for repair shops, service centers, and electronics hobbyists.  

Upgrade your rework capabilities with the Hi-620D – your reliable partner for precision BGA soldering and desoldering.